Description
BUY NTP45N06 https://www.utsource.net/itm/p/11742094.html
Parameter |
Symbol |
Min |
Typical |
Max |
Unit |
Condition |
Drain-Source Voltage |
VDS |
- |
- |
60 |
V |
- |
Gate-Source Voltage |
VGS |
-10 |
- |
20 |
V |
- |
Continuous Drain Current |
ID |
- |
- |
45 |
A |
TC = 25掳C |
Pulse Drain Current |
ID(pulse) |
- |
- |
135 |
A |
tp = 10 ms, TC = 25掳C |
Gate Charge |
QG |
- |
70 |
- |
nC |
VGS = 10V |
Input Capacitance |
Ciss |
- |
1300 |
- |
pF |
VDS = 0V, f = 1 MHz |
Output Capacitance |
Coss |
- |
290 |
- |
pF |
VDS = 25V, f = 1 MHz |
Reverse Transfer Capacitance |
Crss |
- |
100 |
- |
pF |
VDS = 25V, f = 1 MHz |
RDS(on) at VGS = 10V |
RDS(on) |
- |
5.5 |
- |
m惟 |
ID = 45A, TC = 25掳C |
RDS(on) at VGS = 4.5V |
RDS(on) |
- |
8.5 |
- |
m惟 |
ID = 45A, TC = 25掳C |
Total Power Dissipation |
PTOT |
- |
- |
175 |
W |
TC = 25掳C |
Junction Temperature |
TJ |
- |
- |
150 |
掳C |
- |
Storage Temperature |
TSTG |
-55 |
- |
150 |
掳C |
- |
Instructions for Use:
Voltage Handling:
- Ensure that the drain-source voltage (VDS) does not exceed 60V to prevent breakdown.
- The gate-source voltage (VGS) should be kept between -10V and 20V to avoid damage.
Current Handling:
- The continuous drain current (ID) should not exceed 45A at a case temperature of 25掳C.
- For pulse applications, the peak drain current (ID(pulse)) can reach up to 135A for a pulse duration of 10 ms at a case temperature of 25掳C.
Thermal Management:
- The total power dissipation (PTOT) should not exceed 175W at a case temperature of 25掳C.
- Monitor the junction temperature (TJ) to ensure it does not exceed 150掳C.
Capacitance Considerations:
- Account for the input capacitance (Ciss), output capacitance (Coss), and reverse transfer capacitance (Crss) when designing circuits to minimize switching losses and ensure stable operation.
Storage Conditions:
- Store the device in a controlled environment with temperatures ranging from -55掳C to 150掳C to maintain reliability.
Gate Drive:
- Use appropriate gate drive circuits to ensure that the gate charge (QG) is managed effectively, especially during high-frequency switching operations.
Mounting:
- Ensure proper mounting and thermal management to dissipate heat effectively. Use heatsinks or cooling solutions as necessary.
ESD Protection:
- Handle the device with care to avoid electrostatic discharge (ESD) damage. Use ESD protective equipment and follow standard ESD handling procedures.
(For reference only)
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