NTP45N06

NTP45N06

Category: Available (Qty:9999999)
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Description

BUY NTP45N06 https://www.utsource.net/itm/p/11742094.html

Parameter Symbol Min Typical Max Unit Condition
Drain-Source Voltage VDS - - 60 V -
Gate-Source Voltage VGS -10 - 20 V -
Continuous Drain Current ID - - 45 A TC = 25掳C
Pulse Drain Current ID(pulse) - - 135 A tp = 10 ms, TC = 25掳C
Gate Charge QG - 70 - nC VGS = 10V
Input Capacitance Ciss - 1300 - pF VDS = 0V, f = 1 MHz
Output Capacitance Coss - 290 - pF VDS = 25V, f = 1 MHz
Reverse Transfer Capacitance Crss - 100 - pF VDS = 25V, f = 1 MHz
RDS(on) at VGS = 10V RDS(on) - 5.5 - m惟 ID = 45A, TC = 25掳C
RDS(on) at VGS = 4.5V RDS(on) - 8.5 - m惟 ID = 45A, TC = 25掳C
Total Power Dissipation PTOT - - 175 W TC = 25掳C
Junction Temperature TJ - - 150 掳C -
Storage Temperature TSTG -55 - 150 掳C -

Instructions for Use:

  1. Voltage Handling:

    • Ensure that the drain-source voltage (VDS) does not exceed 60V to prevent breakdown.
    • The gate-source voltage (VGS) should be kept between -10V and 20V to avoid damage.
  2. Current Handling:

    • The continuous drain current (ID) should not exceed 45A at a case temperature of 25掳C.
    • For pulse applications, the peak drain current (ID(pulse)) can reach up to 135A for a pulse duration of 10 ms at a case temperature of 25掳C.
  3. Thermal Management:

    • The total power dissipation (PTOT) should not exceed 175W at a case temperature of 25掳C.
    • Monitor the junction temperature (TJ) to ensure it does not exceed 150掳C.
  4. Capacitance Considerations:

    • Account for the input capacitance (Ciss), output capacitance (Coss), and reverse transfer capacitance (Crss) when designing circuits to minimize switching losses and ensure stable operation.
  5. Storage Conditions:

    • Store the device in a controlled environment with temperatures ranging from -55掳C to 150掳C to maintain reliability.
  6. Gate Drive:

    • Use appropriate gate drive circuits to ensure that the gate charge (QG) is managed effectively, especially during high-frequency switching operations.
  7. Mounting:

    • Ensure proper mounting and thermal management to dissipate heat effectively. Use heatsinks or cooling solutions as necessary.
  8. ESD Protection:

    • Handle the device with care to avoid electrostatic discharge (ESD) damage. Use ESD protective equipment and follow standard ESD handling procedures.
(For reference only)

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