Description
KennTherm X1 thermal compound is a non-silicone grease with extremely low thermal impedance and long-term stability. The proprietary- formulated thermal compound can be spread easily and evenly. It can be stored with no special requirement.
Features
- Excellent performance
- Excellent long-term stability
- Non-corrosive
- No special requirements for storage
- Easy to apply and less to use
- No “ burn-in” time required
- Low dry-out
- Not electrically conductive
Specification
|
Properties |
Test Methods |
Units |
Typical value |
|
Color |
|
|
Grey |
|
Consistency |
ASTM D217 |
|
170 |
|
Specific Gravity |
ASTM D1475 |
g/cm3 |
2.5 |
|
Viscosity |
BrookField CVE #7 @12RPM |
Cps |
<2000K
|
|
Thermal Properties |
|
|
|
|
Thermal Conductivity |
ASTM D5470 |
W/m-K |
6.5 |
|
Thermal Impedance |
ASTM D 5470 |
K-in2/W |
0.009 |
|
Dry Out Test |
240 hours at 363K |
Weight% |
0.03 |
Contact our Thermal Paste Consultant in area Malaysia (Selangor(Klang, Shah Alam, Subang), Kuala Lumpur(Sungai Buloh), Sepang, Negeri Sembilan, Melaka, Johor(Johor Bharu,Muar,Batu Pahat), Pahang(Temerloh, Kuantan), Kelantan, Terengganu, Perak(Ipoh), Kedah, Perlis, Penang, Sabah, Sarawak), Indonesia, Singapore, Thailand, Philippines, Vietnam, Laos, Myanmar, Cambodia, Brunei at [email protected].
Malaysia
