BOURNS SF-0603HI-F SMD FUSES SINGLEFUSE

BOURNS SF-0603HI-F SMD FUSES SINGLEFUSE

分类: SinglFuse SMD Fuses 当前有货
欲了解更多详情,请游览我们的官方网站 mobicon.com.my

详情

Footprint 603
Technology Thin Film PCB
Fuse Type High Inrush Withstand
Fusing Time 200 % Ir in 1 min.
Rated Current 0.5 A - 4.0 A
Rated Voltage 35 - 65 VDC
Operating Temp. (°C) –55 – +90
Agency Certificates UL
MDS MDS
Design Files Design Files

更多 MOBICON-REMOTE ELECTRONIC SDN BHD 相关资料
MOBICON-REMOTE ELECTRONIC SDN BHD
MOBICON-REMOTE ELECTRONIC SDN BHD Electronic Components Selangor, Penang, Test & Measurement Instruments Supply Kuala Lumpur (KL), Automation Parts Supplier Malaysia ~ MOBICON-REMOTE ELECTRONIC SDN BHD