Microporous type Vacuum Chucks (Vacuum Clamping Systems)
Even clamping of thin-walled, sensitive and flexible substrates. Conventional, heated, cooled or with transmitted light.
Witte microporous vacuum chucks are the ideal solution for clamping and fixing for measuring and test procedures, for precision machining and in silicon wafer production. Substrates such as RFID films or wafers are not deformed by suction holes, suction grooves, etc.
Witte microporous chucks can be heated or cooled, each with appropriate controls. Special systems for transmitted light applications are also available. For microporous surfaces Witte offers a wide variety of materials, for example sintered bronze, ceramics or aluminum. Even black and fluorescent clamping surfaces are available.
Applications
measuring, checking and machining of thin-walled substrates (e.g., papers, foils, circuit boards, wafers, PCB boards),
fine (e.g., optics) and
flexible (e.g., rubber) materials
measuring and testing
pecision machining
silicon wafer production
Special advantages
no deformation of the workpieces, as there are no grooves or holes
VGSM Technology (M) Sdn BhdMeasuring Equipment Malaysia, Measuring Metrology Products Supplier, Malaysia Measuring System ~ VGSM Technology (M) Sdn Bhd
Malaysia
