Durostone CHP760 PCB Solder Pallet Materials

Durostone® materials have been developed for all procedures within the PCB assembly process. There are three main grades which are suitable for use in the SMT reflow and wave soldering processes. Durostone® CHP760, CAS761 and CAG762. These materials offer the following features:

• Excellent mechanical properties at elevated temperatures in both the wave soldering and SMT reflow processes.
• Low thermal conductivity.
• Excellent machining properties enabling the manufactures of complex design solder pallets.
• Good resistance to chemicals used in modern fluxes.