SR-SCOPE® DMP30

Measure copper thickness on printed circuit boards quickly, accurately, non-destructively, and without the influence of underlying copper layers, with the SR-SCOPE® DMP30.  

Features 

• Robust and powerful handheld device for measuring copper thickness on printed circuit boards
• Measuring method: Micro resistance
• Measured value memory: 250,000 measured values in 2,500 batches
• Rugged aluminum housing with IP64 protection, Gorilla Glass and soft bumpers
• Exchangeable Li-Ion battery for > 24 h operating time
• Easy data transfer via USB-C and Bluetooth
• Live feedback via light, sound and vibration for limit monitoring
• Cal Check function to verify your currently used calibration
• Digital probe available
• Available with the new Tactile Suite software

Discover the new SR-SCOPE® DMP30 now

• PRODUCTOVERVIEW TACTILE

• Measurement of copper thickness on the top side of printed circuit boards and multilayers, without insulated deeper copper layers influencing the measurement.
• Measuring range with probe D-PCB: copper layer thicknesses from 0.5 - 10 µm and 5 - 120 µm

With extensive functionalities and processed in a robust and high-quality housing with a modern design and intuitive Tactile Suite software, our SR-SCOPE® DMP30 is the ideal choice for measuring copper layers on printed circuit boards. Connect the D-PCB digital probe to the SR-SCOPE DMP30 and measure conductivity using the electrical 4-point resistance method according to DIN EN 14571.

• MEASUREMENT OF THE COPPER THICKNESS ON PRINTED CIRCUIT BOARDS