Deskripsi
For Sip / Wafer Level Mini Underfill / Extreme Fine Silver Paste Dispensing Path / Narrow Gap Filling
Automated Dispensing System,SSL Series Is Specifically Designed For Semiconductor Micro Fluid Packaging Applications For Narrow Gap Filling, Fine Line Dispensing And Micro Underfill With Small Machine Footprint And Aggressive Price. Ssl Has Outstanding Performance Of Motion Route Repeatability And Accuracy, Capable To Precisely Fill Silver Epoxy Into 170um Narrow Gap As Well As Precisely Dispense 0.2 Nl Material In Total Volume Along The Dispensing Route Whatever It Is Line, Square, Circle Or Any Other Shapes. Ssl Series Is Designed To Be Able To Accept Up To 12'' Wafer For Extreme Precision Dispensing And Repeated Dispensing Path Accuracy Regardless Dot, Line Or Curve Shape.
Extremely High Precision Hardware Specifications
Automated Dispensing System SSLSeries Has A Special Machine Base And Gantry Designed By Ssi Research Team With Software Simulation To Meet The Highest Repeatability Accuracy Of ±1um And Position Accuracy Of ±2um For The Goal Of Lower Budget And Highest Performance.
Versatile Automated Dispensing System For All Precision Applications Different
- Piezo Jet Valve For High Speed Jetting
- Progressive Cavity Pump (pcp) For Precision High Viscosity Contact Dispensing
- Deposition Pump For < 100 Um Dispensing
- Solder Paste Jetting Valve
- Thin Film Ultrasonic Spray Coater
- 10:1 High Precision Mixing And Dispensing
- High Precision Air Spray
Most Advanced Dispensing Vision Software With Motion Control
Ssi Vision Software Is The Most Advanced Dispensing Software Integrating Motion Control And Vision Alignment With The Following Features :
- Support Secs / Gem And Mapping Requirements
- Close Loop Flow Volume Control
Automatically Checking The Dispensing Volume On Micro Scale, Monitoring, Auto Adjusting And Evenly Distribute The Dispensing Volume Alone The Dispensing Route
- Quick Process Parameters Setting
Just Set Up Single Chip Dispensing Parameters Then The Software Can Duplicate The Same Parameters On All Chips On The Wafer
- Effective Dispensing Delay Time Control
Underfill Takes Time To Diffuse, With Only Few Chip Delay Time Parameters, V2k Can Automatically Calculate The Proper Dispensing Delay Time For All Chip On The Wafer
- Stream Motion
A Dot To Dot Control Technology, Which Synchronize Dispensing Frequency And The Motion Speed Enabling The Uniform Dispensing Result Regardless Acceleration, Deceleration Or Turning
- Real Time Dispensing Height Measurement And Compensation
- Fiducial On Fly
Integrated Vision Capabilities For Auto Alignment And Optical Inspection For 2d And 3d
- Remote Teaching
Engineers Can Remotely Teach The Robot Without Sitting In Front Of The Machine
Post Dispensing Precision Automatic Optical Inspection
SSL Series Also Supports Post Glue Inspection After Dispensing For Any Kind Of Glue And Substrate Background To Eliminate The Cost From Defective Dispensing As A Result Of Customized Algorithms And Software Modification For Individual Process. Ssi Unique Glue Inspection Capability Is Completely Different From Competitors Approach Using Available Standard Vision Solution In The Market, Which Often Ends With High Percentage Of False Inspection And Creates Defects. Sl Series Customized Vision Inspection Capability Can Assure 98-99 % Detection Rate After Dispensing Process And Increases Overall Yield.
With All Above Hardware, Software And Vision Capabilities, System Option For Conveyor With Tray, Cassette, Magazine, Wafer Cassette And Fop.
Solder Paste Dispensing Capability, extreme small dot and line
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