Bend Type Profile Back Cover YPC-WD

Bend Type Profile Back Cover YPC-WD

Kategori: TOUCH SCREEN INDUSTRIAL PANEL PC Tersedia
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Deskripsi



Features :
 

Product size 13.3 inches/15.6 inches/18.5 inches/21.5 inches/23.6 inches/27 inches
Touch type Capacitive
Appearance color Black front frame, gray back cover
Motherboard solution DB02 series motherboard
Product material Bent front frame, profile back cover
Ordering Information  (I3/I5/I7) 10th generation series dual network/6*serial ports/4*USB
(I3/I5/I7) 7th generation series B version dual network/6*serial ports/4*USB
(I3/I5/I7) 7th generation series version A single network/2*serial port/4*USB
 

Lihat detail lebih lanjut tentang SEM Equipment Sdn. Bhd.
SEM Equipment Sdn. Bhd.
SEM Equipment Sdn. Bhd. Industrial Equipment Manufacturer, Ultrasonic Equipment Supplier, Laser Equipment Supply in Johor Bahru (JB), Malaysia ~ SEM Equipment Sdn. Bhd.