Description
Microsolve Co-Solvent ultrasonic cleaning systems provide two ultrasonic cleaning stages, followed by vapour rinsing and freeboard drying.
In the first cleaning stage a mixture of HFE and a hydrocarbon solvating agent removes gross contamination from the components. Large quantities of dirt and oils can be taken up by the solvating agent, making the process particularly suitable for heavy duty ultrasonic cleaning applications.
The Co-solvent process handles with ease applications such as removal of polishing compounds, maintenance cleaning of power generation system components, and flux removal from PCBs, including no-clean and lead-free solder flux residues.
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CO-SOLVENT MODEL |
350C |
450C |
525C |
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350
250
300 |
450
325
300 |
525
415
350 |
Please contact us for South East Asia Market, Malaysia, Vietnam, Indonesia, Thailand, Philippines, Singapore, Brunei, Laos, Myanmar, New Zealand and Australia for more information.
More detail about XTS Technologies Sdn Bhd
Malaysia
