BOURNS SF-0603SP SMD FUSES CIRCUIT PROTECTION

MOBICON-REMOTE ELECTRONIC SDN BHD

Category: BOURNS Available

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Description

Footprint	603
Technology	Thin Film Sputtering
Fuse Type	Time Lag
Fusing Time	200 % I_r in 1 – 120 sec.
Rated Current	500 mA - 6.0 A
Rated Voltage	32 – 50 VDC
Operating Temp. (°C)	–20 – +105
Agency Certificates	UL
MDS	MDS

More detail about MOBICON-REMOTE ELECTRONIC SDN BHD

MOBICON-REMOTE ELECTRONIC SDN BHD Electronic Components Selangor, Penang, Test & Measurement Instruments Supply Kuala Lumpur (KL), Automation Parts Supplier Malaysia ~ MOBICON-REMOTE ELECTRONIC SDN BHD

Malaysia