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BOURNS SF-1206FP SMD FUSES CIRCUIT PROTECTION
BOURNS SF-1206FP SMD FUSES CIRCUIT PROTECTION
MOBICON-REMOTE ELECTRONIC SDN BHD
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BOURNS
Available
For more information, visit our official website at
mobicon.com.my
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Description
Footprint
1206
Technology
Thin Film Sputtering
Fuse Type
Fast Acting Precision
Fusing Time
200 % I
r
in 5 sec.
Rated Current
500 mA - 7.0 A
Rated Voltage
32 – 63 VDC
Operating Temp. (°C)
–20 – +105
Agency Certificates
UL
MDS
MDS
More detail about MOBICON-REMOTE ELECTRONIC SDN BHD
MOBICON-REMOTE ELECTRONIC SDN BHD
Electronic Components Selangor, Penang, Test & Measurement Instruments Supply Kuala Lumpur (KL), Automation Parts Supplier Malaysia ~ MOBICON-REMOTE ELECTRONIC SDN BHD
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Malaysia