HAD 810
Automatic Plane-type Die Bonder
Cycle: 220ms
Compatible with IC frames
Features
1. Linear motors design enables the application of double adhesive-dispensing bond heads.
2. High-precision linear driving die bond tieback, voice coil torsion loop controls die bonding pressure accurately.
3. High-precision die-platform search system, servo motor drive die-angle correction system, equipped together with an automatic film expansion system.
4. A separate dispensing control system is used to have a precise control over the glue-dispensing amount.
5. Vacuum die missing testing technology is adopted.
6. IPC will control the equipment, simplifying the equipment operation with user-friendly interfaces.
Specifications and Parameters
| 1.Production Cycle | 4.Die Bonder’s Swing Arm-and-hand system | |||
| Production Cycle | 220ms (depending on chip size and bracket) | Die Bonder Swing Arm | 150mm linear motor reciprocate die bonding | |
| Accuracy | ±0.6mil ±0.015mm | Die Bond Pressure | 20g-250g (Adjustable) | |
| Accuracy (Up-look inspection) | ± 1mil ±0.025mm | 5.Suitable Holder Size | ||
| Die Rotation | ± 1° | |||
| 2.Chip XY Table | Length | 110mm ~ 280mm | ||
| Chip Dimensions |
5mil×5mil-100mil×100mil (0.13mm*0.13mm-2.54mm*2.54mm) (If utilizing glue-disk dispensing way, given the die is lesser than 12mil) |
Width | 25mm ~ 110mm | |
| Max. Angle Correction | 360° | 6.Facilities Needed | ||
| Max. Chip Ring Size |
Outer Diameter: 296mm Inner Diameter: 254mm |
Voltage/Frequency | 220V AC±5%/50HZ | |
| Max. Chip Area | 205mm (expanded) | Compressed Air | 0.5MPa（MIN） | |
| Resolution | 0.04mil (1μm) | Rated Power | 1820W | |
| Thimble Z Height Travel | 80mil（2mm) | Gas Consumption | 5L/min | |
|
Suitable Iron ring/ wafer |
Standard Equipped with 10″Iron Ring and 8″Wafer | |||
| Compatible with 8″Iron Ring and 6″Wafer | ||||
| 3.Image Recognition System | Suitable Barrel Spec. |
Standard Equipped with 10CC (Compatible with 5CCand 3CC) |
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| Image Identification | 256 grayscale | 7.Volume and Weight | ||
| Resolution | 656 x 492 pixels | Length x Width x Height | 205 x 135 x 190cm | |
| Image Recognition Accuracy |
±0.025mil@50mil observation range |
Weight | 1800kg | |
Malaysia
