UV Dicing Tape
Kategori: Tapes
Tersedia
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Penerangan
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Ideal for protecting & fixing wafer in dicing processes.
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Low adhesive strength allows easy peel after UV radiation.
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No chip damage and contamination in die pick up.
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Total thickness (um):90+5
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Adhesion (g/25mm) : before UV -110+10, After UV -5+2
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Max width: 1000mm
Manufactured by ULS
Lebih maklumat tentang ULS Industries Sdn Bhd
ULS Industries Sdn Bhd
Latex Gloves Supplier Melaka, Disposable Medical Supplies, Office Stationery Supply Malaysia ~ ULS Industries Sdn Bhd
Malaysia
