Penerangan
Further improvement of production efficiency, high-performance & flexible CMP system
- Dry-in/Dry-out
- Excellent process performance
- Reliable structure (one table-one head, dual module system)
- High operation rate/High throughput
- Suitable for multi-stage chemical cleaning
- Detection monitor at polishing endpoint (optional)
- In-line film thickness measuring device (optional)
- Diverse functions and flexible equipment configurations
- Module structure easy to modify and maintain
- Flexible transport mechanism
Features and Benefits
With a newly developed high-efficiency transport mechanism and WPH optimization algorithm, Ebara's highly reliable structures are maintained, such as one table-one head and a dual module system, enabling further productivity improvement. Adopting a flexible transport mechanism and further measures against cross-contamination contributes to improved yield. It also adopts a module structure that is easy to modify and upgrade, enabling installing new functions with less time in the future. In addition, power consumption is reduced by approximately 10% compared to the Model F-REX300X type, and the number of parts is also reduced, thereby achieving sustainability goals like reducing CO2 emissions in the supply chain. It supports more environmentally friendly semiconductor manufacturing.
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