Features of DOWSIL™ SE 4485 Thermally Conductive Adhesive
One-part material
Semi flowable
Fast tack-free time
Good adhesion
Thermally conductive
UL 94 V-0 recognised
Applications
DOWSIL™ SE 4485 Thermally Conductive Adhesive is designed to provide efficient thermal transfer for the cooling of modules, including lamp, telecom, and power supply devices.
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Malaysia
