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Features |
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High-resolution and high-precision X - Y table.
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Capable of handling 12″ wafer.
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High speed inspection.
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Micro defect inspection of up to 5 micron.
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Window platform with user-defined specification.
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Built-in calibration feature.
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Auto-generation of GR & R report.
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Library based uploading for different types of die.
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Malaysia
