CircuitWorks® Thermal Paste facilitates heat transfer away from electrical/electronic components. This heavy consistency material is thickened with a heat conductive filler to maintain a positive heat sink seal in electrical/electronic equipment.
Heat Sink Grease (CT40-5)
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Silicone-base
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Thermally stable from -40°F(-40°C) to 392°F (200°C)
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Meets MIL-DTL-47113D Type I
Silicone Free Thermal Paste (CW7270)
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Silicone free compound avoids silicone migration
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Thermally stable from -99.4°F(-73°C) to 392°F (200°C).
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Exceeds MIL-C-47113 for thermal conductivity
Boron Nitride Thermal Paste (CW7250, CW7250KG)
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Provides maximum thermal conductivity with superior dielectric properties
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Silicone free compound will not harden or dry out
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Thermally stable from -99ºF (-73ºC) to 392ºF (200ºC)
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Exceeds MIL-C-47113 for Thermal Conductivity