DEVCON 5 MINUTE EPOXY 14250
DESCRIPTION
A rapid-curing, general-purpose adhesive / encapsulant. It forms a hard, rigid bond or coating in minutes FEATURES • 100% reactive, no solvents • Good dielectric strength • Good solvent resistance
RECOMMENDED APPLICATIONS
• Cures fast for quick metal to metal bonding and repairs • Pots and encapsulates electronic components and assemblies • Suitable for bonding metals, fabrics, ceramics, glass, wood and concrete (in combinations)
Malaysia
