The thermal shock test chamber is the perfect testing machine of electronic components, metal, chemical materials, automation components, communication module, national defense industry, aerospace industry, BGA, PCB substrate, electronic chip IC, semiconductor ceramic and high polymer materials.
Test standards:
GB11158 GB10589-89 GB10592-89
GB/T10586-89 GB/T2423.22-2001 GB/T2423.1-2001
GB/T2423.2-2001 GB/T2423.3-93 GB/T2423.4-93
ASTM D1735 EIA - 364-59 IEC60068-2-1.1990
IEC60068-2-2.1974 IEC 68-2-30 IEC68-2-03 EIA - 364-31C
Specifications:
Inner Size(mm) | 400×350×300 | 400×500×400 | 500×600×500 | 500×750×600 |
Temperature Range | High temperature chamber:RT~+150°C Low temperature:RT~-60°C | |||
Temperature Deviation | Less than ±2°C | |||
Temperature Conversion Time | Less than 10S | |||
Temperature Recovery Time | Less than 5min | |||
Material |
External material: SUS#304 Stainless steel plate Internal material:SUS#304 Stainless steel plate |
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Coolting System |
Water-cooled or air-cooled, Tecumseh compressor in France, Environment friendly refrigerant |
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Controllor | Programmable temperature controllor | |||
Temperature Sensor | PT 100 *3 | |||
Setting Range |
TEMPERATURE : -100.00+200.00°C / TIME : OH1M ~ 9999H 59M / CYCLE ~ 10000 CYCLE |
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Resolution | TEMPERATURE : 0.01°C / TIME : 1 MIN | |||
Output Mode | PID + PWM + SSR CONTROL METHOD | |||
Simulated Load IC (KG) | 3.5kg | |||
Standard Accessories | Cable hole, lighting equipment | |||
Cooling System | Water-cooled/air-filled type | |||
Power | AC380V/50HZ Three-phase four-wire ac power | |||
Additional Features |
The outlet and return it checks for taste known control /CM BUS (RS-485) remote monitoring management system /Ln2 liquid nitrogen rapid cooling control device |
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Remarks |
It can be customiazed according to customer demands. Technology index refer to product description.Delivery time within 45days |
Working Principle
Sample is placed in the test chamber, more extreme temperature than test temperature can be set in high-temperature chamber and low-temperature chamber. When it comes to low temperature test, cold chamber door open, and low-temperature chamber working together with test chamber.
When converted into high-temperature test, cold chamber door closed, hot chamber door are opened, and test chamber working together with high-temperature chamber.
Conversion of mechanical action (transferring from high temperature to low temperature or low temperature to high temperature) can be completed in less than 1second, and the temperature can be quickly stabilized. During the whole test, test sample is no need to be moved, and without any human intervention.
Applications
Thermal Shock Chamber have been designed to operate in accordance with reliability programs, quality control, commercial test programs and medical tests. It is used to test the capability of material structure or composite material to withstand the continuous environmental changes between extremely high temperature and low temperature during a short period. It is applicable to metals, plastic, rubber, electronics amongst other materials. The test result can be used as a reference or basis for produce improvement.
Features