Features:
Non-contact micro air soldering system for soldering tiny solder joints.
Stable hot air flow and good soldering quality.
No solder residues generated, no consumables produced, and saving costs.
With the specially designed heating element, it has a wide temperature range, no oxidation and long service life.
It is especially suitable for the rear heating of the solder paste process.
Parameters:
Stroke Parameter: Reference carrying platform
Flow: 0-4 L/min
Temperature Range: 50-550℃ (Max, working mode selection)
Heating Controller Power: 300 W
Malaysia
