Features:
A 10-section temperature zone designed to control the temperature and time of any zone and customize the reflow process.
Optional reflow soldering process camera, multi-angle observation of solder paste reflow interval changes.
It heats using internal circulation hot air to completely simulate the reflow heating process.
Nitrogen can be inputted for protecting the heating to ensure high quality soldering.
Built-in automatic cooling design, the cooling rate controllable.
Specifications:
Power Supply: 220 V AC 50 Hz
Peak Power: 3300 W
Air / Nitrogen Inlet Pressure: ≤ 0.5 MPA
Max. Flow Of Reflow Fan: 1.6 – 1.8 m^3/min/220V
Max. Cooling/ Heating Rate: ≤ 3 ℃/S
Max. PCB Size: 150 mm * 200 mm
Weight: About 60 kg
Overall Dimensions (L*W*H): 800 * 650 *650 mm
Malaysia
