Features:
Open dark infrared heating, no nozzles required, low costs of use.
The non-contact infrared sensor monitors the BGA temperature real-timely, and the desoldering is under control.
Intelligent and highly automated, computer controlled.
Easy to learn; successful soldering only takes 10 minutes of operation.
Specifications:
| General Power | 2400 W (Max.) |
| Power Supply | 220 V AC 50 Hz |
| Top Hot Air Heating Power | 720 W |
| Bottom Preheating Power | 400 W * 4 = 1600 W (infrared heating plate) |
| Bottom Radiation Preheating Size | 260 mm * 260 mm |
| Max. Circuit Board Size | 420 mm * 400 mm |
| Communication | Standard RS-232 C (connected with PC) |
| USB Port | Output 5V DC, 1A, connected to USB lighting equipment |
| Infrared Temperature Sensor | 0 - 300 ℃ |
| Weight | About 54 kg |
| Overall Dimensions (L*W*H) | 800 * 580 * 520 mm |
Malaysia
