RANKCONN - Pin Adhesion Attachment
Brand: Rankconn Instruments
Product introduction:
It is used to test the bonding strength of corrugated cardboard after being pasted. It can be tested by placing it between the two pressure plates of the ring pressure testing machine.
The main technical parameters:
Model name
|
Adhesive clamp
|
Type
|
A, B, C
|
Volume A
|
125*76*30
|
Volume B
|
91*76*30
|
Volume C
|
109*76*30
|
Weight A
|
500g
|
Weight B
|
350g
|
Weight C
|
400g
|
Sample
|
80*25mm/50*150mm
|
