SWPF SOLVENT-BASED is a low viscosity, solvent based fast evaporating fluid for use in light to medium duty stamping and punching applications. This product has high level of lubricity and offers excellent finishing to the pressed metals without leaving any residue or oily film on the finished components. The fluid is virtually colorless and is most suitable for forming of copper, aluminum and light sheet metal. It can be used for both ferrous and non-ferrous metals and will not stain the material.
Performance Benefits
| Fast Drying | Lubricants Metal Surfaces |
| Provide Quality Finishes and accuracy | Easy Removal |
| Enhance Die Life | Does not contain harmful or toxic components to the skin |
