Description
Further improvement of production efficiency, high-performance & flexible CMP system
- Dry-in/Dry-out
- Excellent process performance
- Reliable structure (one table-one head, dual module system)
- High operation rate/High throughput
- Suitable for multi-stage chemical cleaning
- Detection monitor at polishing endpoint (optional)
- In-line film thickness measuring device (optional)
- Diverse functions and flexible equipment configurations
- Module structure easy to modify and maintain
- Flexible transport mechanism
Features and Benefits
With a newly developed high-efficiency transport mechanism and WPH optimization algorithm, Ebara's highly reliable structures are maintained, such as one table-one head and a dual module system, enabling further productivity improvement. Adopting a flexible transport mechanism and further measures against cross-contamination contributes to improved yield. It also adopts a module structure that is easy to modify and upgrade, enabling installing new functions with less time in the future. In addition, power consumption is reduced by approximately 10% compared to the Model F-REX300X type, and the number of parts is also reduced, thereby achieving sustainability goals like reducing CO2 emissions in the supply chain. It supports more environmentally friendly semiconductor manufacturing.
More detail about EBARA PRECISION MACHINERY MALAYSIA SDN. BHD.
