OKAMOTO GNX12PB Wafer Grinding, Lapping and Polishing equipment is a precision optical machining tool designed for use in the production of semiconductor devices. This precision machine is capable of polishing, lapping and grinding work pieces with a variety of abrasive materials, from coarse to fine grit sizes and in various contact angles. Its grinding head is designed with a potentiometer cyclic speed, to ensure a smooth and accurate grinding process. Manual grinding feed is also possible. The machine has a steady and reliable movement of the head, allowing precision cutting and polishing. It is well-suited for various material types, such as quartz, silicon and sapphire.
Vintage: 2008
Size: 8"
Malaysia
