Description
Product Overview
Miniature modules available for cooling components such as infra-red detector chips, microwave IC's, fibre-optic lasers and detectors.
- Bespoke designs available
- All types of modules can be bonded using heat sink bonder
- Wide variety of finishes available for specific operating ranges or regimes
- Our standard devices cover a wide range of pellet geometries
- Single-stage modules can create systems which are effective from a few mW to few hundred Watts of cooling power
- Silicone sealed for moisture protection
- Multicomp products are rated 4.6 out of 5 stars
- 12 month limited warranty *view Terms & Conditions for details
- 96% of customers would recommend to a friend
More detail about ELSO Technologies Sdn Bhd
Malaysia
