Thermal Interface Products Insulator, 12''x12'' Sheet, 0.010'' Thickness, Sil-Pad IDH 2189912
BERGQUIST® SIL PAD TSP 3500 is a thermally-conductive, insulating, rigid, pre-cured pad used between heat sink or metal housing and components. It is formulated to maximize both the thermal and dielectric performance of the filler/binder matrix. The conformable material is grease free and reinforced with fiberglass, providing high reliability for electronic packaging applications.
· Thermal impedance: 0.33°C (32.6°F) -in2/W at 50 psi
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Typical applications include power supplies, motor controls, power semiconductors, aerospace, and avionics. For information on UL certifications for our Thermal Management Materials Portfolio,please refer to UL file No. E59150.
Malaysia
