HAD 308
Plane-type High Speed Die Bonder
Cycle: 80ms
Compatible with SMD, COB, Diodes, Flip-chip, etc.
Features
1. Internationally leading double die-bonding, double adhesive-dispensing and double die-searching system.
2. Linear motor is applied to drive bond head.
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C).
4. Crystal frame automatic correction chip structure.
5. Programmed control constant-temperature adhesive dispensing system is also applied.
6. Vacuum die missing testing technology is adopted.
7. Loading by free-loading magazine with paper suction function (eliminate the frame release paper), to largely improve the production efficiency.
8. IPC will control the equipment, simplifying the equipment operation with user-friendly interfaces.
9. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness.
10. Precise die bond location and excellent compatibility will guarantee the back-end processing.
Specifications and Parameters
| 1. Production Cycle | 4. Die Bonder’s Swing Arm-and-hand system | ||
| Production Cycle | 80ms (depending on chip size and bracket) | Die Bonder Swing Arm | 90° Rotatable Die Bond |
| Accuracy | ± 1mil (±0.025mm） | Die Bond Pressure | 20g-250g (Adjustable) |
| Die Rotation | ± 1° | 5. Loading Workbench | |
| 2. Chip XY Workbench | Range of Stroke | 300mm*75mm | |
| Chip Dimensions |
5mil×5mil-80mil×80mil (0.13mm*0.13mm-2mm*2mm) |
XY Resolution | 0.02mil (0.5μm) |
| 6. Suitable Holder Size | |||
| Max. Angle Correction | ± 15° | Length | 145mm ~ 300mm |
| Max. Chip Ring Size | 8″/210mm (Outer Diameter) | Width | 40mm~ 75mm |
| Max. Chip Area | 6.5″/165mm (Expanded) | 7. Facilities Needed | |
| Resolution | 0.04mil (1μm) | Voltage/Frequency | 220V AC±5%/50HZ |
| Thimble Z Height Travel | 80mil (2mm) | Compressed Air | 0.5MPa (MIN) |
| Rated Power | 950W | ||
| 3. Image Recognition System | Gas Consumption | 5L/min | |
| Image Identification | 256 grayscale | 8. Volume and Weight | |
| Resolution | 656 x 492 pixels | Length x Width x Height | 175 x 125 x 185cm |
| Image Recognition Accuracy |
± 0.025mil@50mil Observation Range |
Weight | 1470kg |
Malaysia
