Mega Etch

The Mega Etch was designed with the PCB manufacturer in mind. This system gives an engineer the ability to open IC packages which are still attached to the original printed circuit board. This process enables the IC to maintain electrical functionality and system state even after an operation has been performed. With an exposed silicon die the package can be examined through a variety of common semiconductor failure analysis techniques. The Mega Etch includes all functionality of other RKD Engineering decapsulator models in addition to this critical process.

Product Information
 

The Mega Etch includes the same functionality of all other RKD Engineering decapsulator models with additional features. It operates at temperatures up to 250° C enabling operational versatility with any combination of acids. This model improves upon the design of the Elite Etch series with an expanded decapsulation chamber and ESD mitigation. The expanded space surrounding the etch head allows a complete PCB to be prepared for failure analysis by using a gasket stack up with correct definitions cut. The Mega Etch can accommodate a PCB up to 152.5 x 152.5 mm (6 x 6 in).

 

The Mega Etch features an acid controller etch head which is machined from premium grade silicon carbide for unsurpassed acid resistance. The etch head is designed to reduce the fuming of any residual acids left on the etch head at the end of the process, both for operator safety and convenient acid disposal.

 

The IC is held in place by a pneumatically activated push rod called the ram nose. The ram nose is normally retracted and extends when the safety cover is fully closed. The ram nose ensures that the IC package and a definition gasket are secured to the etch head, thus eliminating movement of either the package or its fixturing. The ram nose is connected to a high impedance resistor network to further aid in ESD mitigation during decapsulation. The use of an electrically isolated, yet dissipative ram nose assembly prevents ESD problems within the circuitry being exposed.

 

RKD Engineering incorporates double containment for all fluid couplings between the bottle container and the decapsulator. The bottle box assembly and the etcher unit both contain fluid sensors to alert the operator in the event of an acid leak from any of the bottles or internal fittings. The bottle box incorporates a universal pivoting interconnect which allows simple bottle exchange with minimal exposure to residual acid.

 

To mitigate ESD problems when handling decapsulated packages on a board, including removal of the board from the decapsulator, rinsing, drying etc. The Mega Etch system is equipped with two ESD panel mounted sockets and circuitry for the attachment of ESD tweezers and a wrist strap. The unit however may be operated without appropriate grounding.