Probe Features:
Prevents DPS damage.
No need to solder or glue the thermocouple to the PCB.
It reduces labor costs, assembly and disassembly takes only a few seconds.
Gets reliable profiles - high pressure and low thermal mass give a fast and reliable response.
Wet solder paste profiling - profile of the first pass of the PCB through the oven.
Temperature monitoring anywhere - the small and durable tip of the thermocouple fits even in tight spaces.
More accurate results with no additional material (solders or epoxy) used to attach the thermocouple.
