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The best probing solution for the diced device WLCSP and Package Substrate (BGA, QFN, etc.) |
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Compensates the shifted position and performs Multi-die probing. |
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Successful record of Alignment for customers' products is 100%. (Record only in Japan) |
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Multi-area probing is available when more than two package substrates are on a film frame. |
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Capable of reconstructed wafer on a film frame. |
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Probing more than two points by moving in a chip (Micro Probing) |
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The ring clamp method is used so it is not influenced even if a film is slacked or sagged. |
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Chip smaller than 1mm is handled by small-diameter VAC holes. |
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Sandblast finish of chuck surface and chuck air-blow-mechanism improve the detachability from the chuck. |
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Low noise More than -80dB on the chuck |
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High rigidity cabinet made by the iron surface plate and the welding frame realizes low vibration |
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Low cost and High throughput |
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Small space (Footprint), power-saving design |
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Stable operation (more than MTBF5000 hours) |
