• Flip Chip Technology: High Flexibility
• High accuracy : Chip Placement +/-3μm at 3sigma
• UPH: 2000 components / hour (1,8 sec dry cycle)
• Process: Bondheads Thermosonic & Thermocompression
• Bond Force: 5N to 490N
• Substrate Size: up to 320 x 250mm, Optional 12” wafer
• Supply Method: up to 12inch wafer, Tray 2 inch & 4inch
• Chip Size: 1mm to 20mm sq. (optional: small die 0,5x0,5mm)
• Dipping option: Flux and Silver Paste transfer unit
• Ultrasonics: 60KHz, 0.01sec increments
• Apps.O2: Med I/O (20 to 100 pins) / High I/O (>= 100)
• Hepa Filter: Class 700 if production floor 35.000 used
• Footprint: 1.65m x 1.38m
