KAIJO FB 900 Bonder is a fully automated reflow soldering equipment and is specifically designed to meet the requirements of high quality and highly accurate LED and LED array soldering. FB 900 Bonder offers reliable, precise and fast reflow-soldering for LED products such as flexible LED strips, array LED boards, and LED modules. This system allows for a wide range of temperature levels, as well as automated temperature profiling, time and energy control, and precise solder print profiles. KAIJO FB 900 Bonder features a heated contact wheel that ensures precise placement of heated solder on the LED board. The heated wheel provides a consistent surface temperature and accurate transfer of heat.
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