FEATURES
The tension control of all tapes is possible, and the best condition according to the back of the process can be obtained.
Tape feeding, winding and cutting are automatic, and a release film winding system is also available. (UV tape can be used)Tension control for all types of tapes is possible, so the optimal coating can be achieved to match post-processing requirements.
Compatible with thin wafers.
The mounting in vacuum eliminates the generation of air bubbles and does not damage the wafer.
The mounting in vacuum eliminates the generation of air bubbles and does not damage the wafer.
