Machine is specialized for the WSP (Wafer Scale Package)
Total process System: Picking Die up from Wafer -> Quality (Appearance) Inspection and Alignment with Cameras -> Tape & Reel
Smooth Handling of Die (No pressure or damage on Die)
Extra small Die (up to 0.5mm square) can be applied with the Full Vision support and accurate mechanism.
Can be applied in various ways, such as Wafer to Tape, Wafer to Tray, Tray to Tape, Tape to tape/Tray (de-taping)
Wafer Auto laoding system is provided
