Mass production equipment for anodic bonding, eutectic bonding, glass bonding, frit glass bonding, direct bonding, resin bonding, and adhesive bonding.
We have achieved complete automation and improved mass productivity.
Our unique heating method enables rapid heating and cooling.
It has a structure that allows direct heating of the board and minimizes the difference between the heater temperature and the board temperature.
High-precision alignment is possible when used in conjunction with an alignment device.
Recipe management and data logging management via PC is available as an option.
Anodic bonding function can be added as an option.
