BOURNS SF-0603HI-F SMD FUSES SINGLEFUSE

MOBICON-REMOTE ELECTRONIC SDN BHD

Kategorya: SinglFuse SMD Fuses Magagamit

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Deskripsyon

Footprint	603
Technology	Thin Film PCB
Fuse Type	High Inrush Withstand
Fusing Time	200 % I_r in 1 min.
Rated Current	0.5 A - 4.0 A
Rated Voltage	35 - 65 VDC
Operating Temp. (°C)	–55 – +90
Agency Certificates	UL
MDS	MDS
Design Files	Design Files

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MOBICON-REMOTE ELECTRONIC SDN BHD Electronic Components Selangor, Penang, Test & Measurement Instruments Supply Kuala Lumpur (KL), Automation Parts Supplier Malaysia ~ MOBICON-REMOTE ELECTRONIC SDN BHD

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