Deskripsyon
An advanced aqueous stencil cleaner specifically designed for the semiconductor industry. This highly effective cleaner is formulated to remove all types of raw solder pastes, uncured chip bonder, and inks from stencils, webbing frames, and misprinted boards with ease.
Key Features:
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Versatile Cleaning: Suitable for use in ultrasonic immersion and spray-in-air stencil cleaning machines.
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Non-Flammable and Low Odor: Ensures a safer and more pleasant working environment.
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Comprehensive Compatibility: Safe for all metals, synthetics, plastics, and elastomers.
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Low Foaming: Enables efficient cleaning without excessive foam buildup.
Advantages:
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Non-Silicate Formula: Prevents scaling on equipment.
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Low VOC: Environmentally friendly with minimal volatile organic compounds.
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ESD Safe: Suitable for use in environments where electrostatic discharge is a concern.
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Non-Nonylphenol Formulation: Free from harmful nonylphenol ethoxylates.
Specifications:
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Rinsing: Complete
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Foam Generation: Low
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pH: 11-12
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Appearance: Clear Liquid
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Fragrance: Slightly Aromatic
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Viscosity: 1 cps
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Storage: Store in a cool and dry area
Choose our cleaner for your semiconductor spray cleaning machine to achieve optimal cleaning performance and maintain the integrity of your equipment.
Contact us for more information
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