Description
BUY GB10NC60KDSF https://www.utsource.net/itm/p/12597553.html
Parameter |
Symbol |
Min |
Typical |
Max |
Unit |
Input Voltage |
VIN |
4.5 |
- |
14 |
V |
Output Voltage |
VOUT |
3.3 |
- |
5.5 |
V |
Output Current |
IOUT |
- |
10 |
20 |
A |
Efficiency |
畏 |
- |
92 |
97 |
% |
Switching Frequency |
fSW |
- |
600 |
- |
kHz |
Quiescent Current |
IQ |
- |
1.2 |
- |
mA |
Dropout Voltage |
VDROPOUT |
- |
0.3 |
- |
V |
Operating Temperature |
TOPR |
-40 |
- |
125 |
掳C |
Storage Temperature |
TSTG |
-40 |
- |
150 |
掳C |
Junction Temperature |
TJ |
-40 |
- |
150 |
掳C |
Instructions for Use:
Input Connection:
- Connect the input voltage (VIN) to the positive terminal and ground (GND) to the negative terminal.
- Ensure the input voltage is within the specified range of 4.5V to 14V.
Output Configuration:
- Set the output voltage (VOUT) to the desired level within the range of 3.3V to 5.5V using the external feedback resistor network.
- The output current should not exceed 20A to avoid damage to the device.
Thermal Management:
- Ensure adequate heat dissipation to keep the junction temperature (TJ) below 150掳C.
- Use a heatsink or thermal pad if necessary, especially under high load conditions.
Efficiency Optimization:
- For optimal efficiency, operate the device at its typical switching frequency of 600kHz.
- Minimize quiescent current by ensuring proper circuit design and component selection.
Operating Environment:
- The device can operate in environments with temperatures ranging from -40掳C to 125掳C.
- Store the device in a dry place with temperatures between -40掳C and 150掳C.
Protection Features:
- The device includes overcurrent protection and thermal shutdown to prevent damage under fault conditions.
- Monitor the dropout voltage to ensure it remains below 0.3V for stable operation.
Handling and Installation:
- Handle the device with care to avoid static discharge and physical damage.
- Follow recommended soldering profiles to ensure reliable connections during PCB assembly.
Testing and Validation:
- Perform initial testing at low loads to verify correct operation before moving to full load conditions.
- Regularly inspect the device and surrounding components for signs of wear or overheating.
(For reference only)
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