Description
BUY IRFP450 https://www.utsource.net/itm/p/12543079.html
Parameter |
Symbol |
Min |
Typical |
Max |
Unit |
Conditions |
Drain-to-Source Voltage |
VDS |
- |
- |
500 |
V |
|
Gate-to-Source Voltage |
VGS |
-15 |
- |
20 |
V |
|
Continuous Drain Current |
ID |
- |
8 |
- |
A |
TC = 25掳C |
Pulse Drain Current |
ID(p) |
- |
16 |
- |
A |
tp = 10 ms, TC = 25掳C |
Total Power Dissipation |
PT |
- |
- |
110 |
W |
TC = 25掳C |
Junction Temperature |
TJ |
- |
- |
150 |
掳C |
|
Storage Temperature Range |
Tstg |
-55 |
- |
150 |
掳C |
|
Thermal Resistance (J-C) |
R胃JC |
- |
0.75 |
- |
掳C/W |
|
Input Capacitance |
Ciss |
- |
1500 |
- |
pF |
VDS = 0 V, f = 1 MHz |
Output Capacitance |
Coss |
- |
400 |
- |
pF |
VDS = 250 V, f = 1 MHz |
Reverse Transfer Capacitance |
Crss |
- |
300 |
- |
pF |
VDS = 250 V, f = 1 MHz |
On-State Resistance |
RDS(on) |
- |
0.95 |
- |
惟 |
VGS = 10 V, ID = 8 A |
Gate Charge |
QG |
- |
50 |
- |
nC |
VDS = 400 V, VGS = 15 V |
Instructions for Use:
Mounting and Heat Sinking:
- Ensure proper heat sinking to maintain the junction temperature within the specified limits.
- Use a thermal compound to improve thermal conductivity between the device and the heat sink.
Biasing:
- Apply a gate-to-source voltage (VGS) within the specified range to turn the device on or off.
- For reliable operation, ensure VGS is at least 10 V to fully enhance the device.
Current Handling:
- Do not exceed the continuous drain current (ID) rating.
- For pulse applications, ensure the pulse duration (tp) does not exceed 10 ms to avoid overheating.
Voltage Ratings:
- Do not exceed the maximum drain-to-source voltage (VDS) or gate-to-source voltage (VGS).
- Ensure the device is properly protected against overvoltage conditions.
Thermal Management:
- Monitor the junction temperature (TJ) to prevent thermal runaway.
- Use appropriate cooling methods such as forced air cooling or liquid cooling if necessary.
Storage:
- Store the device in a dry, cool environment within the storage temperature range (Tstg).
Handling:
- Handle the device with care to avoid mechanical damage.
- Use anti-static precautions to prevent damage from electrostatic discharge (ESD).
(For reference only)
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