GT30F124

GT30F124

Category: Available (Qty:9999999)
For more information, visit our official website at utsource.us

Description

BUY GT30F124 https://www.utsource.net/itm/p/12542677.html

Parameter Symbol Min Typical Max Unit Description
Supply Voltage VDD 2.7 - 5.5 V Operating voltage range
Output Current IO - 100 - mA Maximum output current per channel
Standby Current ISB - 10 - 渭A Current consumption in standby mode
Operating Temperature TOPR -40 - 85 掳C Operating temperature range
Storage Temperature TSTG -65 - 150 掳C Storage temperature range
Input Voltage Range VIN 0 - VDD V Input voltage range for logic inputs
Output Low Voltage VOL - 0.4 0.9 V Output low voltage at IO = 100 mA
Output High Voltage VOH 2.4 - VDD V Output high voltage at IO = -100 mA
Propagation Delay tpd - 15 - ns Propagation delay time (input to output)
Power Dissipation PD - - 600 mW Maximum power dissipation per package

Instructions:

  1. Power Supply:

    • Ensure the supply voltage (VDD) is within the specified range of 2.7V to 5.5V.
    • Use a stable power source to avoid fluctuations that could affect performance.
  2. Output Current:

    • Do not exceed the maximum output current of 100 mA per channel to prevent damage to the device.
    • If higher currents are required, consider using external drivers or transistors.
  3. Standby Mode:

    • The device consumes a very low current (10 渭A typical) in standby mode, which can be useful for power-sensitive applications.
  4. Temperature Considerations:

    • Operate the device within the specified temperature range (-40掳C to 85掳C) to ensure reliable performance.
    • Store the device in a temperature range between -65掳C and 150掳C.
  5. Input Voltage:

    • Logic inputs should be within the range of 0V to VDD to avoid damage or incorrect operation.
  6. Output Levels:

    • The output low voltage (VOL) should not exceed 0.9V at 100 mA output current.
    • The output high voltage (VOH) should be at least 2.4V at -100 mA output current.
  7. Propagation Delay:

    • The typical propagation delay time (tpd) is 15 ns, which is important for timing considerations in digital circuits.
  8. Power Dissipation:

    • Ensure that the total power dissipation does not exceed 600 mW to avoid overheating and potential damage to the device.
    • Use appropriate heat sinking if operating near the maximum power dissipation limit.
  9. Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow standard ESD (Electrostatic Discharge) precautions when handling and installing the device.
  10. Mounting:

    • Ensure proper mounting on the PCB to maintain good thermal and electrical connections.
    • Follow the recommended PCB layout guidelines provided by the manufacturer for optimal performance.
(For reference only)

More detail about Utsource Holding Company Limited
Utsource Holding Company Limited
Utsource Holding Company Limited Electronic Component Wholesaler, IC Chip Distributor, IGBT Module Supplier in California, USA | Utsource Holding Company Limited