Description
BUY MIP0223SY https://www.utsource.net/itm/p/12404098.html
Parameter |
Symbol |
Value |
Unit |
Supply Voltage |
VDD |
1.7 to 5.5 |
V |
Operating Current |
IDD |
1.5 |
渭A |
Output Current (Max) |
IOUT |
100 |
mA |
Output Voltage |
VOUT |
1.8, 2.5, 3.0, 3.3, 5.0 |
V |
Dropout Voltage |
VDROPOUT |
0.2 |
V |
Load Regulation |
|
卤1% |
|
Line Regulation |
|
卤1% |
|
Ripple Rejection |
|
60 dB |
|
Operating Temperature |
Toper |
-40 to +85 |
掳C |
Storage Temperature |
Tstg |
-65 to +150 |
掳C |
Package |
|
SOT-23 |
|
Instructions for Using MIP0223SY
Supply Voltage (VDD):
- Ensure the supply voltage is within the range of 1.7V to 5.5V.
- Use appropriate decoupling capacitors (typically 10渭F and 0.1渭F) close to the input pin to filter out noise and stabilize the supply.
Output Voltage (VOUT):
- The output voltage is fixed and can be selected from 1.8V, 2.5V, 3.0V, 3.3V, or 5.0V depending on the specific part number.
- Use a suitable output capacitor (typically 10渭F) to stabilize the output and reduce ripple.
Output Current (IOUT):
- The maximum output current is 100mA. Ensure that the load does not exceed this limit to avoid damage to the device.
Dropout Voltage (VDROPOUT):
- The dropout voltage is 0.2V. This means the input voltage must be at least 0.2V higher than the output voltage to ensure proper regulation.
Load and Line Regulation:
- The load and line regulation are both 卤1%. This ensures that the output voltage remains stable under varying load conditions and input voltages.
Ripple Rejection:
- The device provides 60dB ripple rejection, which helps in maintaining a clean output voltage even when the input has significant ripple.
Operating and Storage Temperature:
- The operating temperature range is -40掳C to +85掳C, and the storage temperature range is -65掳C to +150掳C. Ensure that the device is used within these limits to avoid performance degradation or failure.
Package:
- The device is available in a SOT-23 package, which is small and easy to solder. Ensure proper handling and soldering techniques to avoid damage to the device.
Mounting and PCB Layout:
- Place the device close to the load to minimize trace resistance and inductance.
- Use wide and short traces for power and ground connections to reduce parasitic effects.
- Ensure adequate thermal management if the device is expected to operate near its maximum current or in high ambient temperatures.
Testing:
- Before finalizing the design, test the device under various operating conditions to ensure it meets the required specifications and performance criteria.
(For reference only)
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