MIP0223SY

MIP0223SY

Category: Available (Qty:9999999)
For more information, visit our official website at utsource.us

Description

BUY MIP0223SY https://www.utsource.net/itm/p/12404098.html

Parameter Symbol Value Unit
Supply Voltage VDD 1.7 to 5.5 V
Operating Current IDD 1.5 渭A
Output Current (Max) IOUT 100 mA
Output Voltage VOUT 1.8, 2.5, 3.0, 3.3, 5.0 V
Dropout Voltage VDROPOUT 0.2 V
Load Regulation 卤1%
Line Regulation 卤1%
Ripple Rejection 60 dB
Operating Temperature Toper -40 to +85 掳C
Storage Temperature Tstg -65 to +150 掳C
Package SOT-23

Instructions for Using MIP0223SY

  1. Supply Voltage (VDD):

    • Ensure the supply voltage is within the range of 1.7V to 5.5V.
    • Use appropriate decoupling capacitors (typically 10渭F and 0.1渭F) close to the input pin to filter out noise and stabilize the supply.
  2. Output Voltage (VOUT):

    • The output voltage is fixed and can be selected from 1.8V, 2.5V, 3.0V, 3.3V, or 5.0V depending on the specific part number.
    • Use a suitable output capacitor (typically 10渭F) to stabilize the output and reduce ripple.
  3. Output Current (IOUT):

    • The maximum output current is 100mA. Ensure that the load does not exceed this limit to avoid damage to the device.
  4. Dropout Voltage (VDROPOUT):

    • The dropout voltage is 0.2V. This means the input voltage must be at least 0.2V higher than the output voltage to ensure proper regulation.
  5. Load and Line Regulation:

    • The load and line regulation are both 卤1%. This ensures that the output voltage remains stable under varying load conditions and input voltages.
  6. Ripple Rejection:

    • The device provides 60dB ripple rejection, which helps in maintaining a clean output voltage even when the input has significant ripple.
  7. Operating and Storage Temperature:

    • The operating temperature range is -40掳C to +85掳C, and the storage temperature range is -65掳C to +150掳C. Ensure that the device is used within these limits to avoid performance degradation or failure.
  8. Package:

    • The device is available in a SOT-23 package, which is small and easy to solder. Ensure proper handling and soldering techniques to avoid damage to the device.
  9. Mounting and PCB Layout:

    • Place the device close to the load to minimize trace resistance and inductance.
    • Use wide and short traces for power and ground connections to reduce parasitic effects.
    • Ensure adequate thermal management if the device is expected to operate near its maximum current or in high ambient temperatures.
  10. Testing:

    • Before finalizing the design, test the device under various operating conditions to ensure it meets the required specifications and performance criteria.
(For reference only)

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