Description
BUY KTC4373-Y https://www.utsource.net/itm/p/12401458.html
Parameter |
Symbol |
Min |
Typ |
Max |
Unit |
Supply Voltage |
Vcc |
2.7 |
- |
5.5 |
V |
Operating Temperature |
Topr |
-40 |
- |
85 |
掳C |
Storage Temperature |
Tstg |
-65 |
- |
150 |
掳C |
Input Current |
Iin |
- |
1 |
3 |
mA |
Output Current |
Iout |
- |
10 |
20 |
mA |
Rise Time |
tr |
- |
10 |
30 |
ns |
Fall Time |
tf |
- |
10 |
30 |
ns |
Propagation Delay |
tpdl |
- |
5 |
10 |
ns |
Power Dissipation |
Pd |
- |
- |
150 |
mW |
Quiescent Current |
Iq |
- |
0.1 |
1 |
渭A |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (Vcc) is within the range of 2.7V to 5.5V.
- Connect the Vcc pin to a stable power source.
Temperature Considerations:
- Operate the device within the temperature range of -40掳C to 85掳C for optimal performance.
- Store the device between -65掳C and 150掳C.
Current Ratings:
- The input current should be between 1mA and 3mA.
- The output current should not exceed 20mA, with a typical value of 10mA.
Timing Parameters:
- Ensure that the rise time (tr) and fall time (tf) are within 10ns to 30ns.
- The propagation delay (tpdl) should be between 5ns and 10ns.
Power Management:
- The maximum power dissipation (Pd) should not exceed 150mW.
- Keep the quiescent current (Iq) below 1渭A for low-power applications.
Handling and Storage:
- Handle the device with care to avoid damage from electrostatic discharge (ESD).
- Store the device in a dry, cool environment to prevent degradation.
Mounting:
- Follow the recommended PCB layout guidelines to ensure proper thermal management and electrical performance.
- Use appropriate soldering techniques and temperatures to avoid damaging the device.
Testing:
- Before final assembly, test the device under typical operating conditions to ensure it meets all specifications.
Compliance:
- Ensure that the device complies with all relevant safety and regulatory standards for your application.
(For reference only)
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