Description
BUY BYV26EGP https://www.utsource.net/itm/p/12401288.html
Parameter |
Symbol |
Min |
Typ |
Max |
Unit |
Notes |
Forward Voltage |
VF |
- |
1.0 |
1.3 |
V @ IF = 20mA |
|
Reverse Breakdown Voltage |
VR |
- |
50 |
100 |
V @ IR = 1渭A |
|
Forward Current (Continuous) |
IF |
- |
- |
100 |
mA @ TA = 25掳C |
|
Forward Current (Pulsed) |
IF(s) |
- |
- |
500 |
mA @ tp = 10ms, fs = 10Hz |
|
Reverse Current |
IR |
- |
100 |
500 |
nA @ VR = 50V, TA = 25掳C |
|
Power Dissipation |
PT |
- |
- |
200 |
mW @ TA = 25掳C |
|
Operating Temperature |
TOP |
-40 |
- |
125 |
掳C |
|
Storage Temperature |
TSTG |
-55 |
- |
150 |
掳C |
|
Thermal Resistance |
R胃J-A |
- |
300 |
- |
K/W |
|
Instructions for Use:
- Mounting: Ensure proper heat dissipation by mounting the BYV26EGP on a heatsink if operating at high current or power levels.
- Reverse Voltage: Do not exceed the maximum reverse voltage to avoid damage.
- Forward Current: Stay within the continuous and pulsed forward current ratings to prevent overheating.
- Temperature Range: Operate within the specified temperature range to ensure reliable performance.
- Storage: Store in a dry environment within the storage temperature range to avoid degradation.
- Handling: Handle with care to avoid mechanical damage, especially to the leads.
- Soldering: Use appropriate soldering techniques and temperatures to avoid thermal shock. Soldering temperature should not exceed 260掳C for more than 10 seconds.
- Electrostatic Discharge (ESD): Take necessary precautions to prevent ESD, which can damage the component.
(For reference only)
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