SI7252DP-T1-GE3

SI7252DP-T1-GE3

Category: Available (Qty:9999999)
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Description

BUY SI7252DP-T1-GE3 https://www.utsource.net/itm/p/12361031.html

Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VDD 1.62 - 3.6 V
Operating Temperature TOPR -40 - 85 °C
Output Current IOUT - 50 100 mA Short circuit protection enabled
Load Regulation - 0.2 0.5 % Over full load range
Line Regulation - 0.2 0.5 %/V Over full line range
Dropout Voltage VDROPOUT - 170 300 mV At IOUT = 100mA
Quiescent Current IQ - 25 50 μA No load, VDD = 3.0V
Shutdown Current ISD - 0.1 1 μA VIN = 3.0V, SHDN = LOW
Soft-Start Time tSS - 2 4 ms

Instructions for SI7252DP-T1-GE3

  1. Power Supply Connection:

    • Connect the supply voltage (VDD) within the specified range of 1.62V to 3.6V.
  2. Operating Environment:

    • Ensure the device operates within the temperature range of -40°C to +85°C.
  3. Output Configuration:

    • The output current should be configured not to exceed 100mA to avoid damaging the device. Short circuit protection is built-in but should not be relied upon as a standard operating condition.
  4. Regulation Considerations:

    • Both load and line regulation are critical for maintaining stable output. Ensure these parameters are within 0.2% to 0.5%.
  5. Dropout Voltage Management:

    • Be aware of the dropout voltage, which can vary between 170mV and 300mV at maximum output current.
  6. Current Consumption:

    • Monitor quiescent and shutdown currents to optimize power efficiency, especially in battery-operated devices.
  7. Soft-Start Feature:

    • Utilize the soft-start feature to prevent inrush currents during startup, which takes approximately 2 to 4 milliseconds.
  8. Shutdown Mode:

    • To minimize power consumption, use the shutdown mode by pulling the SHDN pin low. This reduces the current draw to less than 1μA.
  9. Handling Precautions:

    • Handle the component with care to avoid electrostatic discharge (ESD), which can damage sensitive electronic components.
  10. Mounting and Layout:

    • Follow recommended PCB layout guidelines for optimal performance and thermal management.
(For reference only)

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