IPW60R060P7,60R060P7

IPW60R060P7,60R060P7

Category: Available (Qty:9999999)
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Description

BUY IPW60R060P7,60R060P7 https://www.utsource.net/itm/p/11772580.html

Parameter Symbol Value Unit
Maximum Drain-to-Source Voltage VDS 600 V
Continuous Drain Current (Tc = 25掳C) ID 34 A
Continuous Drain Current (Tc = 100掳C) ID 24 A
Pulse Drain Current (Tc = 25掳C, 10 渭s) IDpeak 120 A
Gate-to-Source Voltage VGS 卤20 V
On-State Resistance at 25掳C RDS(on) 60 m惟
On-State Resistance at 100掳C RDS(on) 84 m惟
Total Gate Charge QG 92 nC
Input Capacitance Ciss 1920 pF
Output Capacitance Coss 460 pF
Reverse Transfer Capacitance Crss 250 pF
Junction Temperature Range TJ -55 to 150 掳C

Instructions for Use:

  1. Power Supply and Circuit Design:

    • Ensure that the maximum drain-to-source voltage (VDS) does not exceed 600V.
    • The continuous drain current (ID) should be within the specified limits based on the case temperature (Tc).
  2. Thermal Management:

    • Use appropriate heat sinks or cooling solutions to maintain the junction temperature (TJ) within the range of -55掳C to 150掳C.
    • For high current applications, ensure adequate thermal dissipation to prevent overheating.
  3. Gate Drive:

    • Apply gate-to-source voltages (VGS) within the range of 卤20V to avoid damage to the device.
    • Ensure the gate drive circuitry can handle the total gate charge (QG) to minimize switching losses.
  4. Capacitance Considerations:

    • Account for the input capacitance (Ciss), output capacitance (Coss), and reverse transfer capacitance (Crss) in your circuit design to optimize performance and minimize parasitic effects.
  5. Storage and Handling:

    • Store the device in a dry, cool place to prevent moisture damage.
    • Handle with care to avoid static discharge, which can damage the sensitive MOSFET structure.
  6. Testing and Troubleshooting:

    • Regularly test the device parameters to ensure they remain within the specified limits.
    • If any parameter deviates significantly, check for potential issues such as overheating, incorrect gate drive, or physical damage.
  7. Compliance and Standards:

    • Ensure that the device is used in compliance with relevant safety and regulatory standards for your application.
(For reference only)

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