2SC3263 TO-247 ORIGINAL GOODS IN STOCK

2SC3263 TO-247 ORIGINAL GOODS IN STOCK

Category: Available (Qty:9999999)
For more information, visit our official website at utsource.us

Description

BUY 2SC3263 TO-247 ORIGINAL GOODS IN STOCK https://www.utsource.net/itm/p/11758689.html

Parameter Description Value
Part Number Component Identifier 2SC3263
Package Type Physical Package TO-247
Type Transistor Type NPN Silicon Power Transistor
Collector-Emitter Voltage (Vceo) Maximum Collector-Emitter Voltage 800 V
Collector-Base Voltage (Vcbo) Maximum Collector-Base Voltage 800 V
Emitter-Base Voltage (Vebo) Maximum Emitter-Base Voltage 5 V
Collector Current (Ic) Continuous Collector Current 15 A
Power Dissipation (Ptot) Total Power Dissipation 150 W
Operating Temperature Range (Tj) Junction Temperature Range -55掳C to +150掳C
Storage Temperature Range (Tstg) Storage Temperature Range -55掳C to +150掳C
hFE (DC Current Gain) DC Current Gain 10 to 100 (at Ic = 1 A, Vce = 10 V)
Transition Frequency (ft) Transition Frequency 1 MHz
Saturation Voltage (Vce(sat)) Collector-Emitter Saturation Voltage 1.8 V (at Ic = 15 A, Ib = 1.5 A)
Storage and Handling Recommended Storage Conditions Dry and Cool Environment
RoHS Compliance Compliance with RoHS Directives Yes
Lead Finish Surface Finish of Leads Tin-Plated

Instructions for Use:

  1. Mounting and Handling:

    • Ensure that the mounting surface is clean and flat.
    • Use appropriate heat sink compound to improve thermal conductivity.
    • Avoid excessive mechanical stress on the leads during soldering and handling.
  2. Soldering:

    • Preheat the component to reduce thermal shock.
    • Use a temperature-controlled soldering iron and avoid overheating.
    • Soldering time should not exceed 3 seconds per joint.
    • Allow the component to cool naturally after soldering.
  3. Electrical Connections:

    • Connect the collector, base, and emitter terminals correctly.
    • Ensure that the maximum ratings are not exceeded during operation.
    • Use bypass capacitors to filter out noise and stabilize the circuit.
  4. Thermal Management:

    • Ensure adequate cooling, especially when operating at high power levels.
    • Use a heatsink with sufficient thermal capacity and proper thermal interface materials.
    • Monitor the junction temperature to prevent overheating.
  5. Storage:

    • Store in a dry and cool environment to prevent corrosion and degradation.
    • Keep the components in their original packaging until ready for use.
  6. Testing:

    • Perform initial testing under controlled conditions to verify performance.
    • Use appropriate test equipment and follow safety guidelines.
  7. Disposal:

    • Dispose of the component according to local regulations and environmental guidelines.
    • Recycle if possible.
(For reference only)

More detail about Utsource Holding Company Limited
Utsource Holding Company Limited
Utsource Holding Company Limited Electronic Component Wholesaler, IC Chip Distributor, IGBT Module Supplier in California, USA | Utsource Holding Company Limited