K4A60DA: Top Choice in United States (USA) Utsource Holding Company Limited

Description

BUY K4A60DA https://www.utsource.net/itm/p/11728197.html

Parameter	Description	Value
Device Type	Memory Type	DRAM
Density	Storage Capacity	8 Gb (1 Gx8)
Organization	Internal Organization	8 Banks x 16M x 8-bit
Supply Voltage (VDD, VDDQ)	Operating Voltage	1.35V 卤 0.135V
I/O Standard	I/O Standard	SSTL-15 or SSTL-18
Data Rate	Data Transfer Rate	800 to 2133 Mbps
CAS Latency (CL)	CAS Latency	6, 7, 8, 9, 10, 11, 12, 13, 14, 15
Operating Temperature	Temperature Range	-40掳C to 85掳C (Commercial)
Package	Package Type	BGA (Ball Grid Array)
Pin Count	Number of Pins	78-Pin
Refresh Rate	Refresh Cycle Time	7.8 渭s (tREFI)
Row Address Strobe (RAS) to Column Address Strobe (CAS) Delay	RAS to CAS Delay	10, 12, 14, 16, 18, 20, 22, 24, 26, 28 ns
Write Recovery Time (tWR)	Write Recovery Time	12.5, 15, 17.5, 20 ns
Active to Precharge Delay (tRAS)	Active to Precharge Delay	35, 40, 45 ns
Precharge to Active Delay (tRP)	Precharge to Active Delay	12.5, 15, 17.5, 20 ns
Cycle Time (tRC)	Cycle Time	47.5, 55, 62.5, 70 ns
Power Consumption	Typical Power Consumption	1.5W (Active), 0.1W (Idle)

Instructions for Using K4A60DA:

Power Supply:
- Ensure that the supply voltage (VDD, VDDQ) is within the specified range of 1.35V 卤 0.135V.
- Use a stable power supply to avoid voltage fluctuations.
Signal Integrity:
- Use proper termination techniques to minimize signal reflections and ensure reliable data transfer.
- Keep signal traces as short as possible to reduce noise and crosstalk.
Timing Parameters:
- Configure the memory controller to match the timing parameters specified in the table.
- Adjust the CAS latency (CL) and other timing parameters based on the desired data rate and system requirements.
Temperature Management:
- Operate the device within the specified temperature range (-40掳C to 85掳C).
- Use appropriate cooling solutions if operating in high-temperature environments.
Initialization:
- Follow the initialization sequence recommended by the memory controller to ensure proper operation.
- Perform a self-refresh mode during idle periods to maintain data integrity.
Error Handling:
- Implement error detection and correction (ECC) mechanisms if required for your application.
- Monitor the memory for any errors and take corrective actions as needed.
Testing:
- Perform thorough testing of the memory module to ensure it meets the performance and reliability standards.
- Use diagnostic tools to verify the correct operation of the memory.
Storage and Handling:
- Store the device in a dry and static-free environment.
- Handle the device with care to avoid physical damage to the BGA package.

(For reference only)

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