Description
BUY MG50G2CH1 https://www.utsource.net/itm/p/2148297.html
| Parameter |
Description |
Value |
Unit |
| Part Number |
Full part number |
MG50G2CH1 |
|
| Type |
Component type |
MOSFET |
|
| Package |
Package type |
TO-220 |
|
| Drain Source Voltage |
Maximum drain-source voltage |
50 |
V |
| Continuous Drain Current |
Continuous drain current at 25°C |
2 |
A |
| Pulse Drain Current |
Peak pulse drain current |
8 |
A |
| Gate Source Voltage |
Maximum gate-source voltage |
±20 |
V |
| Power Dissipation |
Maximum power dissipation |
62.5 |
W |
| Junction Temperature |
Maximum junction temperature |
150 |
°C |
| Storage Temperature |
Operating temperature range |
-55 to +150 |
°C |
Instructions for Use:
Handling Precautions:
- Handle with care to avoid damage to the leads and body.
- Use appropriate ESD protection when handling to prevent damage from static electricity.
Mounting:
- Ensure correct orientation before soldering.
- Do not exceed recommended torque values when securing screws in heatsink applications.
Soldering:
- Solder within the recommended temperature and time limits to avoid thermal damage.
- Allow adequate cooling post-soldering.
Electrical Connections:
- Verify all electrical connections are secure and meet specifications.
- Ensure gate drive circuitry is properly designed to minimize switching losses.
Thermal Management:
- Ensure adequate heat sinking if operating near maximum power dissipation.
- Monitor device temperature to ensure it stays within operational limits.
Storage:
- Store in a dry, cool environment away from direct sunlight.
- Keep in original packaging until ready for use to protect against ESD.
(For reference only)
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